Processador Intel Future Roadmaps

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Intel's Process Roadmap to 2025: with 4nm, 3nm, 20A and 18A?!​


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Seguem as legendas...

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Trocando por miudos:
Os 10nm da Intel passaram magicamente a '7' nm
Os 7nm passaram a '4'nm
Os 5nm passaram a '3'nm
os 2nm passaram a '20'A de angstrom, menores que os nm, mas que na verdade 20A correspondem a 2nm.

E assim a Intel passa de estar muito atrás da concorrência para estar, pelo menos, muito aproximada. Há que adorar o marketing.

Vamos invistir bué, mas: se nos derem incentivos fiscais e fundos (provavelmente federais) e um sítio com conta da luz em conta (estaduais).
E apesar de todo o dinheiro da Intel, do que investe em R&D, mesmo com todos estes incentivos que está a 'exigir', vamos lá ver se volta a acompanhar a concorrência.
 
A Qualcomm dizer que está presente nem sequer é grande notícia, é das poucas empresas a apostar desde sempre no dual source, para eles é melhor estar do que não estar caso algo não corra como planeado sempre há um "fallback".

Em relação ao renaming o Charlie... bom foi aquilo que se esperava dele.

The End of The Beginning:

So where do today’s announcements leave us? Intel is putting billions of dollars into a foundry effort with lots of tech and roadmap advances to back it all up. They are serious about being a foundry, no question there, but will customers take their word on anything at this point? The corpses littering the road behind seem to indicate that this is going to be a long slow slog uphill but SemiAccurate is cautiously optimistic that Intel’s new management is turning the ship. There are a lot of listed partners but is anyone putting a serious project on the line at the moment?

On the process naming front we have not one but three changes. The renaming of 10+++/SuperFin+ to 7nm is abjectly stupid and an unforced error that poisons the rest of the changes. 7nm -> 4nm could be warranted as could 5nm -> 3nm but since it all goes to Angstroms after, was there a point? Intel should have left SuperFin+ alone and moved everything else to Angstroms, it would have been a PR benefit instead of several steps backward.
https://www.semiaccurate.com/2021/07/26/intel-renames-processes-with-a-new-roadmap/
 
AWS e Qualcomm não são clientes pequenos. São bons anúncios para uma nova tentativa de fabricar chips para terceiros.
A AWS até é um anúncio interessante, visto que serão uma empresa em competição directa com os produtos Server da Intel.

Vamos ver é se até lá, tudo corre bem.
 
Não sei se era melhor colocar no hardware exótico... mas fica aqui

New Intel IPUs and Mount Evans ASIC is its First DPU Sheds x86​


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Intel Mount Evans DPU IPU​

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On the CPU complex side, we have “up to 16 Arm Neoverse N1 cores.” One can think of these Neoverse N1 cores as similar to AWS Graviton2/ Ampere Altra generation cores. This is quite interesting since at Intel Architecture Day 2021 Intel discussed its Gracemont cores which one would think could be an alternative here, but Intel instead is going with Arm.
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As a quick aside, sixteen Arm Neoverse N1 is a lot. As we have been working with the Mellanox NVIDIA BlueField-2 DPU in the lab, the CPU of the NVIDIA solution leaves a lot to be desired. Sixteen Neoverse N1 cores should help that considerably. We will quickly note that Marvell Octeon 10 400Gbps PCIe Gen5 DPUs will utilize newer Arm Neoverse N2 cores and at much higher core counts (even the development platform in Q4 2021 will be 24x Neoverse N2 cores) and have higher levels of acceleration.
https://www.servethehome.com/new-intel-ipus-and-mount-evans-asic-is-its-first-dpu-sheds-x86-arm/
 
A surpresa...

Intel Wins US Government Project to Develop Leading-Edge Foundry Ecosystem​

The U.S. Department of Defense, through the NSTXL consortium-based S2MARTS OTA, has awarded Intel an agreement to provide commercial foundry services in the first phase of its multi-phase Rapid Assured Microelectronics Prototypes - Commercial (RAMP-C) program.
Intel Foundry Services will partner with industry leaders, including IBM, Cadence, Synopsys and others, to support the U.S. government’s needs for designing and manufacturing assured integrated circuits by establishing and demonstrating a semiconductor IP ecosystem to develop and fabricate test chips on Intel 18A, Intel’s most advanced process technology.
https://www.intel.com/content/www/u...ins-us-project-develop-foundry-ecosystem.html

...não disseram foi qual o valor do acordo.
 

U.S. near deal for Nvidia supercomputer as it waits for delayed Intel machine -sources​


The U.S. Department of Energy is nearing a deal to purchase a supercomputer made with chips from Nvidia Corp (NVDA.O) and Advanced Micro Devices Inc (AMD.O) as a key lab waits for a larger supercomputer from Intel Corp (INTC.O) that has been delayed for months, two people familiar with the matter told Reuters.

The Nvidia and AMD machine, to be called Polaris, will not be a replacement for the Intel-based Aurora machine slated for the Argonne National Lab near Chicago, which was poised to be the nation's fastest computer when announced in 2019.
https://www.reuters.com/technology/...its-delayed-intel-machine-sources-2021-08-24/

devem estar a aproveitar os 300M$ que a Intel vai ter de pagar por falhar sucessivamente os prazos...
 
Afinal parece que o DPU Mount Evans pode nem ser disponibilizado

Intel’s Best DPU Might Not Be Commercially Available​

The third DPU, the Mount Evans device, is perhaps the most interesting in that it was co-designed with that “top cloud provider” and that it has a custom Arm processor complex and a custom network subsystem integrated on the same package.
The compute complex on the Mount Evans device has 16 Neoverse N1 cores licensed from Arm Holdings, which are front-ended by a cache hierarchy that was not divulged and an unusual three DDR4 memory controllers (that’s not a very base-2 number). The compute complex also has a lookaside cryptography engine and a compression engine, thus offloading these two jobs from the host CPUs, and a management complex to allow outboard management of the DPU.
https://www.nextplatform.com/2021/08/31/intels-best-dpu-might-not-be-commercially-available/

Segundo o artigo "pensa-se" que o cliente seja o Facebook.
 

Em relação aquele "Sierra Forest" que parece que terá um Socket com mais de 7000 pinos, apareceu esta imagem.
A plataforma parece chamar-se "Tahachapi Pass" e está marcado como tendo mais de 128 Cores.
A sigla "AP" normalmente é usada pela Intel nos processadores para Servidores com 4 ou mais Sockets, ou naquele "monstro" com 2 Dies de 28 Cores que tinha um TDP de 400W.
Ao mesmo tempo, é interessante aparecer sempre associado aos "Little Cores" da Intel, o Atom, que para o mercado "AP", normalmente não faz muito sentido.
 
Entrevista ao Pat Gelsinger, actual CEO da Intel.

And yeah, AMD has done a solid job over the last couple of years. We won’t dismiss them of the good work that they’ve done, but that’s over with Alder Lake and Sapphire Rapids.
So this period of time when people could say, “Hey, [AMD] is leading,” that’s over. We are back with a very defined view of what it requires to be leadership in every dimension: leadership product, leadership [chip] packaging, leadership process, leadership software, unquestioned leadership on critical new workloads like AI, graphics, media, power-performance, enabling again the ecosystem. This is what we will be doing with aggressive actions and programs over the next couple of years.
When you flip over to the PC side, we’re very happy with [what we presented at Intel] Architecture Day, bringing our hybrid solutions, where we have performance leadership and energy efficiency leadership with Alder Lake. We think that’s a game changer because we’re going to be able to compete on both dimensions where [AMD] is not.
Intel is back. These are the best products in their category. We have the best supply situation. We have the best quality software assets. The most respected, venerable technology brand in the industry. Yeah, that’s what your channel readers need to be delivering to their customers.
And when you think about the data center space, the role of Arm is very minimal today, and us getting our act together, I think it stays that way. I just don’t see that people want to go through all that hard, heavy lifting of changing the software environment for another architecture if there [aren’t] major [total cost of ownership] advantages on the table — and there [aren’t] if we’ve done our job well in that respect.

O Gigante está chateado. :D

We ultimately see the real competition to enable the ecosystem to compete with Apple.
I was on the phone with [Microsoft CEO] Satya [Nadella recently]. “I’m finishing my exit from the Apple closed garden. I’m now on the open ecosystem of Windows and Android, and we’re making that happen.” But our experience has to be better. So that’s ultimately the tablet experience, the phone experience, the peripherals, the PC: They have to have a better experience, supported by a broad ecosystem of innovation. So that’s how we see that space, and ultimately Arm has won the mobile category. We’re now trying to draw our lines successively lower as we go deeper into the tablet and education space as opposed to that [Arm] ecosystem growing up.

Reparem bem que ele destaca a AMD e a ARM, mas o "alvo" final é a Apple. Isto não é por acaso.

Entrevista Completa - https://www.crn.com/slide-shows/com...er-with-new-alder-lake-sapphire-rapids-cpus/2
Resumo - https://www.crn.com/slide-shows/com...er-with-new-alder-lake-sapphire-rapids-cpus/1
 

Inside Intel’s ambitious plans to regain chipmaker dominance​


Intel now has an ambitious roadmap to catch and surpass Samsung and TSMC by 2025. Key to the plan is a series of massive new chip fabrication plants, or fabs, that Intel is building in the U.S., Europe and Israel. Combined, these will cost more than $44 billion.
“I think I have more concrete trucks working for me today than any other human on the planet,” said Intel CEO Pat Gelsinger. “We have construction in Oregon, New Mexico, Arizona, Ireland and Israel. And we expect to plant our next major fabs in the U.S. and Europe before the end of this year.”
https://www.cnbc.com/video/2021/11/...chipmaker-again-beating-tsmc-and-samsung.html

Hydrogen Fuel Injection a Green Upgrade for Thirsty Semi Trucks​

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Intel uses three hydrogen fuel-injected trucks to ship trade show materials around North America, such as CES and the Intel Developer Forum (IDF).
Intel has used the hydrogen-injected trucks since 2010.
https://newsroom.intel.com/editorials/hydrogen-fuel-injection-truck/#gs.fyecr1
 
Não sabia bem onde colocar a noticia, fica aqui:

CEO da Intel a chorar-se para sacar (ainda mais) dinheiro ao governo dos EUA:

Intel CEO Asks US Government for More Backing, Calls Taiwan Not Stable

Since Intel CEO Pat Gelsinger joined the company earlier this year, the messaging language from Intel has changed radically, as it has become a no-nonsense message of Intel going back to its roots as a leading foundry and a leading chip maker. However, Gelsinger might've overstepped a little bit as of lately, as during a conference in California, he went on record saying that Intel deserves special treatment by the US government, in favor of some of its competitors

A sacar dinheiro dos contibuintes/governo para ganhar vantagem é muito fácil CEO. A usar cheats 'givememoney' eu dominava rapidamente qualquer jogo de gestão/estratégia..
 
Logo vi que a estrtégia IDM 2.0 tinha uns quantos de ses

É aproveitar enquanto toda a gente se queixa da falta de componentes electrónicos .

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A sacar dinheiro dos contibuintes/governo para ganhar vantagem é muito fácil CEO. A usar cheats 'givememoney' eu dominava rapidamente qualquer jogo de gestão/estratégia..
A estratégia partiu primeiro do governo americano, a conjuntura actual não é nada causado diretamente pela Intel e ele está a fazer o que qualquer CEO com 2 dedos de testa faria, que é aproveitar boas oportunidades e pedir mais.
 
E no que toca a Taiwan não ser um território estavel. O Pat Gelsinger tem toda a razão, os EUA e o mundo ocidental vão ter de fazer qualquer coisa ou vão ser apanhados com as calças na mão quando a China decidir reinvindicar com aquilo que para eles é deles.

Eles na realidade só estão à espera da desculpa perfeita.
 

IEDM 2021: Intel on Research, Manufacturing in 2025 and Beyond​


At the International Electron Devices Meeting (IEDM), Intel spoke about research and development that is currently being carried out.
As part of the presentation of some research results at the IEDM 2021, Intel assigned these developments to three areas: "Essential Scaling Technologies" (development of new types of transistors in lithography and packaging), "Bringing New Capabilities to Silicon" (further developments in the area of integrated electricity - and power supply, new storage technologies and material research) as well as "New Concepts in Physics" (the search for completely new concepts in computing).
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Foveros Direct is very reminiscent of stacking SRAM like the one AMD uses for the 3D V-Cache . Behind this is the chip stacking SoIC from TSMC
https://www-hardwareluxx-de.transla...sl=de&_x_tr_tl=en&_x_tr_hl=pt-PT&_x_tr_pto=sc


Aparentemente a IEDM foi interessante, mas até agora, artigos só em japonês ou alemão, mas aparentemente as "regras" tem estado a criar alguma confusão

 
A China não tem que disparar uma bala, tem que disparar é biliões de dólares. Já andam a incitar Taiwan para produzir as máquinas que fazem os chips. Há muitas máquinas de fabrico de chips destinadas a Taiwan que acabam por ir para a China e os EUA não estão a gostar da brincadeira. Querem proibir o acesso dos militares chineses a essa tecnologia de ponta. Por outro lado a China está a usar isso como um incentivo para Taiwan desenvolver a tecnologia que actualmente é fornecida por exemplo pela ASML e Applied Materials. Não sei se será fácil, mesmo ignorando o IP que eles não querem saber disso para nada.

sauce:
https://asiatimes.com/2021/12/taiwan-chipmakers-hint-at-decoupling-from-the-us/
 

"Apple M1" development manager changed to Intel​


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Jeff Wilcox, Apple's former developer of the M1, M1 Pro, and M1 Max, announced that he has moved to Intel on his LinkedIn.

He has previously been the director of Mac system architecture, responsible for signal and power integrity, and led the move to Apple Silicon. Prior to that, he was involved in the development of T2 coprocessors and SoCs.

After transferring to Intel, his position has been "Fellow Design Engineer Group CEO / Client SoC Architecture".

By the way, looking at his work history, he was enrolled in Intel between 1997-2007 and 2010-2013. He was a Principal Architect and Engineer at NVIDIA from 2007 to 2008 and Magnum Semiconductor from 2008 to 2010.
https://pc-watch-impress-co-jp.tran...sl=ja&_x_tr_tl=en&_x_tr_hl=pt-PT&_x_tr_pto=sc
 
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