Processador Intel Cascade Lake-X (HEDT)

Nemesis11

Power Member
No mercado HEDT, a Intel vai ter dois chipsets. Z399 e X599.
Z399 para substituir a X299 e terá processadores até 22 cores no socket LGA2066 com 4 canais de memória. Isto é, serão baseados nos Xeons LCC e HCC.
X599 será um chipset C629 "modificado" para o mercado consumidor. Socket LGA3647 com 6 canais de memória. Até 28 cores. Isto é, baseados nos Xeons XCC.

Lançamento do Z399 e versão 22 core, este outono. Versão 28 core no chipset X599, no inicio de 2019.

We heard from a PC manufacturer that the successor of the X299 chipset is supposed to be called Z399. The chipset is intended for the successor of Skylake-X.

How AMD annoys Intel with its chipset naming
The naming of chipsets has repeatedly become a point of conflict between AMD and Intel in recent years. The red team just won’t stop to provocate Intel with its chipset naming. The chipsets of the first Ryzen generation were named A320, B350 and X370. With B350, AMD effectively blocked the successor of B250, which Intel promptly called B360. AMD played the same game with the HEDT brand Threadripper, which received a chipset with the name X399. Intel’s recently introduced Skylake X generation came with the X299 chipset. Even at the upcoming Z390 mainboards, AMD could again be one step ahead – rumors have repeatedly been heard about a Z490 chipset for Ryzen with even more PCIe lanes than X470. Intel now seems to have found a solution for the successor of Skylake-X.

Z399 instead of X399 for successor of Skylake-X

A source at a major computer manufacturer has given us information on what Intel is going to call the successor to X299. The chip company simply changes the letter and launches a chipset called Z399 instead of the X399 which is blocked by Threadripper. The new chipset is allegedly ready for production. It is intended for the successor of Intel’s HEDT division. However, this is not Cascade Lake-X yet, it is just a Skylake-X refresh. This generation will not come with 28 cores yet, only with up to 22 cores. These 22 core processors still fit in Intel’s LGA 2066 socket.

Launch this autumn
Our source has also told us how far production has progressed. Accordingly, there are already motherboards to order. Both the Z399 and the Skylake-X-Refresh are scheduled to be launched this autumn. Probably even October is the date for the launch. Which features the Z399 chipset or the Skylake-X refresh will include is still unknown. Only the core count of 22 cores is known. This is Intel’s first reaction to AMD’s 32-core Threadripper 2990WX. A real competitor, though, will only be the 28-core of the Cascade Lake X series, which is scheduled to start in 2019.

https://www.pcbuildersclub.com/en/2018/09/intel-z399-as-successor-of-x299-for-x-processors/
 
Última edição pelo moderador:
Leak de uma Board da Asus, para o Cascade Lake-X e socket LGA3647:

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Parece ser E-ATX, 12 DIMMs (Hexa Channel), 4 Pci-Ex 16X, Dual Power 24 pinos, SupremeFX e muito plástico.

https://videocardz.com/newz/asus-rog-cascade-lake-x-hedt-motherboard-pictured

EDIT: Alegadamente, os nomes das versões para o socket LGA2066

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https://videocardz.com/78523/intel-to-announce-core-i9-9900xe-basin-falls-refresh-cpu
 
Última edição:
Xeon W-3175X (Shipping em Dezembro, provavelmente será um Cascade Lake)

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3.1 Ghz Base, 4.3 Ghz single core Turbo, 28 cores/56 Threads, Unlocked, 255W de TDP (What??? :n1qshok:)

44 Pci-Ex lanes do cpu, 24 Pci-Ex lanes do Chipset.

Suporte para 512 GB de RAM. Suporte ECC e RAS.

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Asus ROG Dominus Extreme:

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Gama Cascade Lake-X para o socket LGA2066.

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Benchmarks do i8-9980XE contra o TR 2990WX.


https://www.anandtech.com/show/13448/intel-fall-pc-desktop-live-blog-starts-at-10am-et
 
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Um Benchmark da Besta de 28 cores, apesar de não ter uma comparação com outro processador:

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Isto é o tempo de rendering por frame, no Blender, da produtora que fez este filme para a Netflix, com e sem o Embree da Intel, naquele bicho de 28 cores. :)
 
Um Benchmark da Besta de 28 cores, apesar de não ter uma comparação com outro processador:

uwided4.jpg


Isto é o tempo de rendering por frame, no Blender, da produtora que fez este filme para a Netflix, com e sem o Embree da Intel, naquele bicho de 28 cores. :)

Penso que esta besta deve superar a besta de 32 da amd em x de testes mesmo com menos 4 cores.
 
Among the nine EATX power connectors, six are devoted exclusively to 12V power. A staggering 32 power phases stretch across the full width of the board, and they sit under a large heatsink with stealthy active cooling.

Jesus!
 
É um produto para encher chouriços. Dificilmente justificável até por pelos ditos profissionais com dada cadência "elevada".

Pelo preço desta besta podem comprar vários Threadripper / Epyc e ainda um rig secundária Intel com clocks maiores para alguma necessidade particular single thread....
 
Creio ser um daqueles produtos quase que criados exclusivamente para marketing. Nem estou a ver nenhum fabricante fora a Asus/giga a lançar board para suportar isto.

A Asus se o fez já foi uma espécie de troca de favores e claro marketing pelo meio e igual forma, ROG everywhere.

Não esquecer que ROG é Republic of Gamers. Isto não é para gamers, não é para ninguém aliás....
 
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Parece que a Gigabyte também vai a jogo neste socket LGA 3647. Apesar de não mostrarem a ou as boards, lançaram hoje um comunicado. Confirmam também que a board utilizada na apresentação da Intel, com o chiller e os 5 Ghz, era deles:

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards and graphics cards, teamed up with Intel to successfully overclock the Intel Extreme Core Count (XCC) processor past 5GHz across all cores during the Intel Keynote at COMPUTEX 2018. Even without liquid nitrogen (LN2) cooling, the combination of a GIGABYTE motherboard and Intel XCC processor managed to shatter records for single processor socket overclocking. Following Intel's announcement of its Xeon W-3175X processor, GIGABYTE will launch compatible products in the near future.

Multi-core computing has long been instrumental in many different fields of science and technology such as in Physics, Aerospace Technology, Meteorology models/simulations by providing great computing power with impressive accuracy and efficiency. It has also played a huge role in AI development, data mining, and the vastly growing, big data analysis. In the business field today, multi-core computing is also highly useful for financial analysis, stock market analysis, etc. with its fast, accurate calculation abilities. With ultra-high stability, reliability, expert refinement, along with support for the Intel XCC processors, GIGABYTE motherboards are the perfect platform for research institutions, educational institutions, as well as big data centers.

https://www.techpowerup.com/248633/...s-new-opportunities-for-multi-core-processors
 
Cascade Lake-AP. MCM da Intel, com 48 cores. Serão 2 processadores de 24 Cores "colocados" no mesmo package via UPI. 12 canais de memória em cada package. Máximo de 2 Sockets.

Algo bastante parecido com o que a AMD fez com o Epyc, mas só com 2 dies.

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Scaling up to 48-Cores Per CPU
Intel is still keeping a lot of details for Cascade-AP under wraps for now, but what we do know is some high level specifications: Cascade-AP processors will be up to 48 cores, possibly with hyperthreading, and is aimed at dual socket servers, for a total of 96 cores in a 2S system. As a result, a single Cascade-AP is essentially a 2S Xeon setup on a single chip.

Each Cascade-AP processor will have 12 DDR4 DRAM channels, although maximum capacity of memory has not been announced. Connection between the processors will be the standard UPI connection as seen on current Xeon Scalable processors, although connection speed was not specified. It would appear that Cascade-AP is not designed to scale beyond a 2S system.

Each Cascade-AP lake processor will offer up to 48 cores, and in order to do this Intel is using a multi-chip package (MCP). At this point we believe that Intel is using two silicon dies in the package, specifically two ‘XCC’ dies which should be 28-core by design but will be only enabled up to 24-core per silicon die. Intel did confirm that these dies are connected by UPI over the package, and not with Intel’s EMIB technology. This is unfortunate, given how Intel has promoted its EMIB technology as an alternative to interposers, but we have yet to see it in a product that connects two high-powered chips together, as was originally envisioned when the technology was first announced. It does mean however that it can use the same silicon as will be found in the standard Xeon Scalable processors.

No information was given about TDP per processor, or pricing, PCIe lanes, memory capacity/support, frequencies, or variants. We were told that it will be launched at the same time as the full Cascade Lake family ‘in the first part of 2019’ (to directly quote). Intel did give some base performance numbers, suggesting that a processor scores 3.4x higher than an EPYC 7601 on Linpack and 1.3x higher on Stream Triad. Deep Learning inference, a major workload for these new parts, was quoted as scoring 17x the base Skylake-SP launch performance, which would be 1.55x the original quoted Cascade-SP launch performance with the new VNNI instructions.

Given the extra power requirements and extra memory requirements, we fully expect Intel to be using a new socket for this processor. Rather than LGA4367, with 4367-pins, there have been recent leaks suggesting that an LGA5903 socket be where Cascade-AP will end up, although Intel has not confirmed this. Intel did state that Cascade-AP will be shipping for revenue in Q3 2018 to its high-profile customers as part of its early access program, however widespread availability will be ‘in the first part of 2019’.

https://www.anandtech.com/show/13535/intel-goes-for-48cores-cascade-ap

Um socket com quase 6000 pinos....

Quem diria que a AMD deverá apresentar amanhã um novo Epyc com o ZEN2...... :D
 
Estamos mesmo na guerra dos cores e canais de memória. 12 channel? E a Intel está mesmo atacando com tudo e vai para a moda do "colar dies" que criticou tanto à AMD :-D

Venha de lá este EPYC 2. Mas 64 cores com 8-channel acho que será curto :D
 
Estamos mesmo na guerra dos cores e canais de memória. 12 channel? E a Intel está mesmo atacando com tudo e vai para a moda do "colar dies" que criticou tanto à AMD :-D

Venha de lá este EPYC 2. Mas 64 cores com 8-channel acho que será curto :D

Para este numero de cores só colando para não sair super caro . Vamos ver se consegue obter melhor memoria e velocidades entre os dies face amd .
 
O Semiaccurate fala em 350W. Ena.

The 48C per socket means there are two chips in an MCM, XCC dies wired together via QPI links. The inter-socket links are not specified but they are likely not fully connected dies, think a square not a square with an X in the middle. In any case these monsters will be 350W meaning their TCO will be quite questionable in all but a few markets.

https://semiaccurate.com/2018/11/05/intel-announces-cascade-lake-ap-mcm/

Outro ponto interessante vai ser ver a que preço a Intel coloca estes bichos.

Nos benchmarks, a Intel desligou o SMT no Epyc e neste Cascade Lake-AP, mas ainda não vi confirmado que não terá SMT.
 
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